Optimization of a PCB Layout

• Filling in the Unused Spaces: In order to save copper in the etching process it is requested that you fill in any large area on the PCB with black. (In reality this may not always be the best practice for all boards. If you are designing boards which use very high frequencies then this can be a bad idea because the large sections of copper may have inductive and capacitive effects which could effect the operation of the electronics. In some cases, for example circuits with antennas, a large area of copper called a ground plane is actually required. These effects should not be a concern to most circuits constructed here.)
• Rounding Corners: Use the radius tool set to R=1 mm (or any other appropriate radius) to round corners. This may help to make the blue paper peel off easily.
• It is generally best to have the minimum number of jumpers possible.
• It is generally best to have line lengths a short as possible. (This may not effect a high school project but in the 'high tech' world long traces act like small capacitors and can have a great effect with high frequency circuits.)

• The pads presented here are only a suggested designs. You can redesign them to incorporate the optimization mentioned above. A larger pad provides more surface area for a soldered connection. (sometimes this can cause issues with very high frequency boards in industry but we will not need to concern ourselves with this for high school) Larger line traces have a lower chance of having hair line cracks perhaps produced during etching. Copper traces should be separated by a distance which will minimize the risk of a short circuit if the etching is not complete or if sold 'flows' across the divide during soldering.